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HIGH DENSITY FLEXIBLE ELECTRONICS

Flexible PCB Manufacturing

Engineering lightweight, shockproof, and high-density flexible circuits built for demanding 3D dynamic environments.

Flexible Printed Circuit Board
HIGH FLEXIBILITY & DURABILITY

High-Performance Flexible Circuits

Like rigid PCBs, flexible PCBs come in single, double, or multilayer formats. As they need to be printed on specialized flexible substrates, fabrication requires advanced precision controls. AS&R Circuits India Pvt. Ltd. manufactures Flexible PCBs with Immersion Silver, Immersion Gold (ENIG), and OSP surface finishes.

Flexible circuits are engineered using robust polyimide films that can withstand dynamic flexing, vibration, and hostile operating conditions. They are inherently shockproof, corrosion-resistant, and resilient against elevated temperatures and thermal oils—offering spatial versatility that conventional rigid boards cannot achieve.

Advanced Flex Manufacturing Capabilities

  • Adhesiveless Construction: Enables ultra-thin, highly flexible circuits with increased thermal endurance.
  • High Density Additive Processing: Fine line trace and space capabilities down to 0.0015" (38 µm) in full production.
  • Precision Micro Vias: Laser via drilling down to 0.001" (25 µm) diameter for dense 2-layer flex circuits.
  • Selective Gold & Tin-Lead Plating: Facilitates multiple component attachment methods on the same flex circuit assembly.
  • Selective Polyimide Removal: Enables cantilevered and windowed fingers for connector-less interconnects.
  • Alternate Alloy Substrates: Beryllium copper, stainless steel, and cupronickel for specialized spring/contact applications.
  • Fine-Pitch SMT Assembly: Supports component package placement down to 0201 passives and 0.4mm pitch ICs.
  • Rugged Environmental Resistance: Naturally waterproof, shockproof, oil-resistant, and thermal-cycle resistant.
TECHNICAL PARAMETERS

Flex PCB Technical Specifications

Parameter Single & Double Sided Flex Multilayer Flex Circuits
Layer Count 1 to 2 Layers 3 to 8+ Flex Layers
Base Substrate Thickness 0.5 mil to 3.0 mil Polyimide 1.0 mil to 5.0 mil Polyimide
Min Trace Width / Space 0.0015" / 0.0015" (38 µm) 0.002" / 0.002" (50 µm)
Micro Via Diameter Down to 0.001" (25 µm) Down to 0.002" (50 µm)
Coverlay Options Flexible Polyimide Coverlay (0.5 to 2 mil) Photo-imageable Coverlay (LPI) & Flexible Dry Film
Stiffener Options FR-4 Stiffener, Polyimide Stiffener, Aluminum / Stainless Steel Custom Selective Rigid-Flex Hybrid Sections
Surface Finishes Immersion Gold (ENIG), Immersion Silver, OSP ENEPIG, Hard Gold, Selective Gold/Tin-Lead Plating
GOT QUESTIONS?

Frequently Asked Questions

Adhesiveless flex laminates bond copper directly to polyimide film without an acrylic or epoxy adhesive layer. This results in thinner circuit stackups, higher thermal stability, enhanced flexural durability under dynamic bending, and superior signal performance at high frequencies.

Stiffeners (made of FR-4, polyimide, or aluminum) are selectively applied in areas requiring mechanical reinforcement, such as directly under SMT surface components, ZIF connectors, or mounting hole regions, to prevent solder joint fatigue during bending.

Yes, AS&R Circuits provides complete SMT and through-hole assembly services on flexible substrates, accommodating fine-pitch components down to 0201 discrete packages and 0.4mm pitch ICs.
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