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+91 99244 99835 sales@ascrpcb.com
HIGH FREQUENCY RF ENGINEERING

RF Microwave PCB Manufacturing

Engineering time-critical, high-frequency microwave circuits with advanced PTFE laminates and integrated thermal heat sinks.

RF Microwave Circuit Board
PRECISION HIGH-FREQUENCY SOLUTIONS

Time-Critical RF & Microwave Circuit Boards

AS&R has extensive experience and technical expertise in the manufacturing of time-critical, high-technology RF circuits. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF circuits.

We utilize premier laminate and dielectric material suppliers including Isola, Nelco, Rogers, and Taconic. In addition, we manufacture high-frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. These heat sinks and PCBs are typically connected thermally and electrically to assist with thermal dissipation and grounding.

AS&R uses commercially available pre-bonded and post-bonded materials. Pre-bonded laminates are typically supplied by Rogers or Taconic. Post-bonding is completed via sheet film adhesive materials, proprietary sheet film adhesives, or sweat solder.

RF Capabilities

  • Circuit Formats: Single-sided, double-sided, multilayer, and hybrid multilayers.
  • Via Technologies: Blind & buried vias, conductive and non-conductive via fill.
  • Edge & Routing: Castellations, laser-cut vias, and precise board routing.
  • Finishes & Carriers: Wire bondable surface finishes and pre/post-bonded metal-backed circuit boards.
  • Interconnects: Plated through-hole capability connecting metal carriers to PTFE.

Metal Backed PTFE Circuits

  • Aluminum Composites: Custom aluminum composite materials match the coefficient of thermal expansion (CTE) of ceramics, transistor packages, and PCBs.
  • Adhesive Bonding: Thermally and electrically conductive/non-conductive proprietary and commercial adhesive systems.
  • Precision Processing: In-house plating, precision pocket machining, and custom heat sink technology.
  • Assembly Conversions: Pre-bonded to post-bonded assembly conversion and discrete PCB to assembly transitions.
TECHNICAL PARAMETERS

RF Microwave Material & Manufacturing Matrix

Parameter Category Standard RF Processing Advanced Microwave / Metal-Backed
Approved Laminate Suppliers Isola, Nelco Rogers, Taconic
Bonding Technologies Pre-bonded Laminates Post-bonding via Sheet Film, Proprietary Adhesives, Sweat Solder
Thermal & Ground Carriers Standard Copper Planes Aluminum Composites, Copper Carriers, Custom Heat Sinks
Machining & Vias Plated Through-Holes (PTH), Routing Precision Pocket Machining, Laser-cut Vias, Metal-to-PTFE PTH
Surface Finishes ENIG, Immersion Silver Wire Bondable Finishes (Hard Gold / Ultrasonic Aluminum Wire Bondable)
GOT QUESTIONS?

Frequently Asked Questions

Pre-bonded laminates (typically supplied by Rogers or Taconic) arrive from the manufacturer with the dielectric securely bonded to the metal carrier. Post-bonding involves taking unbonded PTFE/microwave materials and bonding them in-house using sheet film adhesives, proprietary adhesive systems, or sweat soldering.

Aluminum composite materials are specifically engineered to match the coefficient of thermal expansion (CTE) of high-power transistors, surface-mounted ceramic packages, and PCBs. This prevents thermal stress failures while utilizing lightweight materials for aerospace and telecommunication environments.

AS&R Circuits maintains extensive experience working with industry-leading high-frequency dielectric suppliers including Rogers, Taconic, Isola, and Nelco.
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