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+91 99244 99835 sales@ascrpcb.com
THERMAL MANAGEMENT & RF CLADDING

RF Metal-Backed PCB Manufacturing

Engineered with aluminum, copper, and brass composites to deliver exceptional thermal dissipation and precise grounding for high-frequency applications.

RF Metal Backed Circuit Board
HIGH THERMAL CONDUCTIVITY

Precision Metal-Clad RF Circuit Boards

AS&R manufactures single-sided, double-sided, and multilayer circuit boards with metal cladding for improved thermal management and grounding. We specialize in high-frequency PCBs featuring integrated metal heat sinks tailored for the telecommunication and aerospace industries. The heat sinks and circuits are connected both thermally and electrically to optimize power dissipation and circuit grounding.

We utilize reliable pre-bonded and post-bonded materials. Pre-bonded laminates are typically supplied by trusted leaders such as Rogers or Taconic. Post-bonding is expertly performed using sheet film adhesive materials, proprietary sheet film adhesives, or sweat solder.

Common applications include RF Power Amplifiers, Splitters & Combiners, Complex Filters, and RF Power Distribution networks. Our material range includes Isola, Nelco, Rogers, and Taconic dielectrics combined with aluminum, copper, and brass composite bases.

RF Metal-Backed Capabilities

  • Lamination Options: Pre-bonded and post-bonded laminate configurations.
  • Adhesive Bonding: Thermally/electrically conductive and non-conductive proprietary adhesive-bonded laminates.
  • Interconnects: Plated through-hole (PTH) capability connecting metal carriers directly to PTFE.
  • Machining & Finishes: Precision pocket machining, heat sink technology, wire bondable finishes, and in-house plating.
  • Assembly Transitions: Pre-bonded to post-bonded assembly conversion and discrete PCB conversions.

Aluminum Composite Technology

AS&R produces PCBs using unique aluminum composite materials engineered to match the coefficient of thermal expansion (CTE) for various high-power, heat-generating components.

  • CTE Matching: Accurately matches the thermal expansion rates of ceramics, transistor packages, and complex circuit assemblies.
  • Design Flexibility: Empowers designers to utilize lightweight metal options while satisfying demanding environmental specifications.
  • Structural Integrity: Eliminates thermal warping and joint fatigue in high-temperature RF amplification modules.
TECHNICAL PARAMETERS

Metal-Backed PCB Specification Matrix

Parameter Category Standard Metal-Backed Specifications Advanced / Custom Engineering
Metal Carrier Options Aluminum, Copper Base Plates Brass Composites, Custom Thermal Alloys
Dielectric Material Brands Isola, Nelco Rogers, Taconic (High Frequency PTFE)
Bonding Methods Pre-bonded Laminates Post-bonding via Sheet Film, Proprietary Adhesives, Sweat Solder
Mechanical & Via Machining Plated Through-Holes (PTH) to Metal Carrier Precision Pocket Machining, Integrated Heat Sink Technology
Target Applications RF Power Amplifiers, Signal Splitters/Combiners Complex Filters, Aerospace Telecommunication Modules
GOT QUESTIONS?

Frequently Asked Questions

Metal heat sinks are connected both thermally and electrically to the circuit board to assist with efficient thermal dissipation and high-frequency grounding, preventing overheating in high-power RF amplifiers and aerospace transmitters.

AS&R Circuits manufactures metal-backed PCBs using aluminum, copper, and brass composite bases, chosen specifically to match the required coefficient of thermal expansion (CTE) and weight parameters of your design.

Primary applications include RF Power Amplifiers, RF Splitters and Combiners, Complex Filters, and RF Power Distribution systems within the telecommunication and aerospace sectors.
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