| Circuit Layer Formats |
Single-Sided Metal Clad |
Double-Sided & Multilayer Metal Core Boards |
| Base Metal Substrates |
Aluminum Base Plates |
Copper Base Plates, Brass Composites |
| Dielectric Thermal Conductivity |
1.0 to 2.0 W/m·K |
3.0 to 8.0+ W/m·K (High Thermal Performance) |
| Approved Laminate Brands |
Ventec, Arlon |
Bergquist, Aismalibar, Laird (Thermagon), CSEM |
| Surface Finishes |
HASL Lead-Free, OSP |
ENIG (Immersion Gold), Immersion Silver, Immersion Tin |