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HYBRID FLEX-RIGID TECHNOLOGY

Rigid-Flex PCB Manufacturing

Seamlessly combining the strength of rigid boards with the 3D spatial adaptability of polyimide flex circuits.

Flex-Rigid Printed Circuit Board
ADVANCED HYBRID FABRICATION

Flex-Rigid Printed Circuit Boards

Building upon our proven expertise in flexible PCBs, AS&R Circuits India Pvt. Ltd. manufactures high-reliability Flex-Rigid PCBs engineered using Polyimide materials and FR-4 cores.

Flex-rigid boards combine the best of both worlds across the two primary PCB architecture types. They feature multiple layers of flexible circuit substrates continuously bonded to multiple rigid PCB sections. This hybrid construction eliminates internal wire connectors and cables, providing extreme shock resistance, weight reduction, and superior reliability in harsh environments.

Advantages of Rigid-Flex Boards

  • Elimination of Wire Harnesses: Direct board-to-board flex transitions eliminate bulky cables, headers, and assembly failure points.
  • 3D Spatial Optimization: Can be folded or contoured to fit tightly inside compact, custom-shaped enclosures.
  • Superior Thermal & Shock Resilience: Polyimide-FR4 hybrid stackups tolerate harsh thermal cycles, high shock, and intense vibration.
  • Reduced Weight & Package Profile: Drastically slashes system mass, making it ideal for aerospace, defense, and medical devices.

Supported Surface Finishes

Electroless Nickel Immersion Gold (ENIG)
Hard Gold (Gold Finger Tabs)
Immersion Silver
Immersion Tin
Organic Solderability Preservative (OSP)
Tin Plating
TECHNICAL PARAMETERS

Rigid-Flex Technical Specifications

Parameter Standard Rigid-Flex Capability Advanced High-Density / Aerospace
Layer Count Range 2 to 8 Layers (Rigid + Flex combination) Up to 20+ Hybrid Layers
Flex Core Substrate Polyimide Film (1 mil / 2 mil) Adhesiveless Polyimide & High-Frequency PTFE
Rigid Substrate Material High-Tg FR-4 (170°C+) Rogers, Isola, Polyimide Rigid Core
Min Trace Width / Space 3 / 3 mil (75 µm) 2 / 2 mil (50 µm)
Via Structures Plated Through-Hole (PTH) Vias Blind & Buried Vias, Laser Microvias, Via-in-Pad
Controlled Impedance ±10% Tolerance ±5% Tolerance (Single-Ended & Differential)
Edge / Tab Contacts ENIG Surface Finish Hard Gold Plated Edge Tabs (up to 30 µin Gold)
GOT QUESTIONS?

Frequently Asked Questions

Flexible polyimide layers are registered and laminated alongside FR-4 rigid core outer layers using acrylic or epoxy prepreg adhesives under high heat and vacuum pressure. Plated through-holes are then drilled through both rigid and flex sections to form unified electrical connections across all layers.

Hard Gold plating (electroplated gold over nickel) provides exceptional wear resistance for edge connector tabs that experience repeated insertion and removal in high-reliability applications.

Rigid-flex technology is widely utilized in aerospace avionics, defense systems, medical devices (such as pacemakers and imaging equipment), military electronics, and automotive sensors where space savings and shock resistance are paramount[cite: 12, 16].
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